SM662PEF BFST Passive IC Components 153-BGA Nand Memory IC EMMC
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...NAND (TLC) Memory IC EMMC 153-BGA (11.5x13) Mfr Silicon Motion, Inc. Series Ferri-eMMC® Product Status Active Memory Type Non-Volatile Memory Format FLASH Technology FLASH - NAND (TLC) Memory Size - Memory Interface eMMC Write Cycle Time - Word, Page - Voltage - Supply - Operating Temperature -40°C ~ 85°C Mounting Type Surface Mount Package / Case 153-TFBGA Supplier Device Package 153-BGA......
Shenzhen Xinyuanpeng Technology Co., Ltd.
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Memory IC Chip AF032GEC5X-2001IX eMMC 256Gbit Flash NAND Memory IC BGA 153
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Memory IC Chip AF032GEC5X-2001IX eMMC 256Gbit Flash NAND Memory IC BGA 153 [MJD Advantage] + 15 years experience for electronic components + Secure Ordering + Excellent Feedback + Delivery Date Guaranteed + 100% Low Price Guaranteed + Export to 108 ......
ShenZhen Mingjiada Electronics Co.,Ltd.
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FLASH - NAND Memory IC 1Gbit Parallel 25 ns 48-TSOP NAND01GW3B2CN6E Used Tested NAND01Good
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FLASH - NAND Memory IC 1Gbit Parallel 25 ns 48-TSOP NAND01GW3B2CN6E Used Tested NAND01Good PRODUCT DESCRIPTION Part number NAND01GW3B2CN6E is manufactured by Micron Technology Inc and distributed by Stjk. As one of the leading distributors of electronic ......
STJK(HK) ELECTRONICS CO.,LIMITED
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KIOXIA THGBMHG7C1LBAIL Emmc FLASH NAND Memory IC Chip 128Gb 16G X 8 52 MHz 153-WFBGA 11.5x13
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Shenzhen Kaigeng Technology Co., Ltd.
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eMMC IC FLASH 64GBIT EMMC 153FBGA FLASH NAND Memory IC 128GB 64Gb 32GB 16GB
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China Chips Star Semiconductor Co., Ltd.
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153WFBGA FLASH - NAND Memory IC 32Gb Emmc 200 Mhz THGBMNG5D1LBAIL
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ShenZhen QingFengYuan Technology Co.,Ltd.
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144TQFP AMD Memory IC NAND FLASH 218-0792006 For IPhone 7 Plus
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...Memory IC NAND FLASH iPhone 7 Plus 218-0792006 144TQFP Memory IC Chip Advanced Micro Devices/AMD 218-0792006 ECAD Module Build or Request PCB Footprint or Symbol Supply and Demand Status Limited Fake Threat In the Open Market 33 pct. Popularity Low Reference case BGA Manufacturer Advanced Micro Devices Manufacturer Homepage www.amd.com Win Source Part Number 743545-218-0792006 Reference Date Code 1035+ Tags: Memory......
Guangzhou Topfast Technology Co., Ltd.
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THGBMDG5D1LBAIT Memory IC Chip
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...t Status Active Memory Format FLASH Memory Type FLASH - NAND Memory Size 32G (4G x 8) Speed 52MHz Interface MMC Voltage - Supply 2.7 V ~ 3.6 V Operating Temperature -25°C ~ 85°C (TA) Package / Case 153-WFBGA Supplier Device Package 153-WFBGA (11x10) ......
KZ TECHNOLOGY (HONGKONG) LIMITED
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AMD Memory IC NAND FLASH iPhone 7 Plus 218-0792006 144TQFP
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... or Symbol Supply and Demand Status Limited Fake Threat In the Open Market 33 pct. Popularity Low Reference case BGA Manufacturer Advanced Micro Devices Manufacturer Homepage www.amd.com Reference Date Code 1035+...
Yingxinyuan Int'l(Group) Ltd.
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ENIG Wire/die Bond BGA package Substrate IC Packaging Substrate fabrication
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Application:IC substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/......
HongRuiXing (Hubei) Electronics Co.,Ltd.
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