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| Categories | Through Hole Assembly |
|---|---|
| MOQ: | 1 |
| Price: | Contact us |
| Payment Terms: | T/T |
| Base material: | FR-4,CEM-3,Aluminum,CEM-1 OR FR-4,Alum |
| Copper thickness: | 0.5-15OZ |
| Min. line spacing: | 2-3mil |
| Board thickness: | 0.2-10mm |
| Min. line width: | 2-3mil |
| Min. hole size: | 0.1mm |
| Surface finishing: | HASL,OSP,ENIG,HASL Lead Free,Immersion Gold |
| Solder mask color: | Green Black Red,Blue.green.red.black.white.etc |
| PCB test: | Flying probe and AOI (Default)/Fixture Test,Flying-Probe PCB test |
| Pcb assembly method: | Mixed,BGA,SMT,Through-hole |
| Company Info. |
| DQS Electronic Co., Limited |
| Verified Supplier |
| View Contact Details |
| Product List |
Intelligent Electronic Large Size Components Through-hole Assembly
♦ What is Through-Hole Assembly?
Through-Hole Assembly is the traditional way of installing electronic components: the component pins are inserted into the pre-drilled holes in the PCB and then fixed by soldering to achieve electrical connection.
♦ Features of Through-Hole Assembly?
♦ Technical Parameters
PCB Assembly Capability | |||||
Item | Normal | Special | |||
SMT Assembly | PCB(used for SMT) specification | Length and Width( L* W) | Minimum | L≥3mm, W≥3mm | L<2mm |
Maximum | L≤800mm, W≤460mm | L > 1200mm, W>500mm | |||
Thickness( T) | Thinnest | 0.2mm | T<0.1mm | ||
Thickest | 4 mm | T>4.5mm | |||
SMT components specification | Outline Dimension | Min size | 0201(0.6mm*0.3mm) | 01005(0.3mm*0.2mm) | |
Max size | 200 * 125 | 200 * 125 | |||
component thickness | T≤15mm | 6.5mm<T≤15mm | |||
QFP,SOP,SOJ (multi pins) | Min pin space | 0.4mm | 0.3mm≤Pitch<0.4mm | ||
CSP/ BGA | Min ball space | 0.5mm | 0.3mm≤Pitch<0.5mm | ||
DIP Assembly | PCB specification | Length and Width( L* W) | Minimum | L≥50mm, W≥30mm | L<50mm |
Maximum | L≤1200mm, W≤450mm | L≥1200mm, W≥500mm | |||
Thickness( T) | Thinnest | 0.8mm | T<0.8mm | ||
Thickest | 3.5mm | T>2mm | |||
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