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0.5oz-15oz OSP Wireless Charger PCBA Through Hole Soldering PCB Board Assembly

Categories Through Hole Assembly
MOQ: 1
Price: Contact us
Payment Terms: T/T
Base material: FR-4,CEM-3,Aluminum,CEM-1 OR FR-4,Alum
Copper thickness: 0.5-15OZ
Min. line spacing: 2-3mil
Board thickness: 0.2-10mm
Min. line width: 2-3mil
Min. hole size: 0.1mm
Surface finishing: HASL,OSP,ENIG,HASL Lead Free,Immersion Gold
Solder mask color: Green Black Red,Blue.green.red.black.white.etc
PCB test: Flying probe and AOI (Default)/Fixture Test,Flying-Probe PCB test
Pcb assembly method: Mixed,BGA,SMT,Through-hole
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0.5oz-15oz OSP Wireless Charger PCBA Through Hole Soldering PCB Board Assembly


Intelligent Electronic Large Size Components Through-hole Assembly


What is Through-Hole Assembly?


Through-Hole Assembly is the traditional way of installing electronic components: the component pins are inserted into the pre-drilled holes in the PCB and then fixed by soldering to achieve electrical connection.


♦ Features of Through-Hole Assembly?


    • ​Component Leads:​​ Components have long, sturdy leads that pass through holes in the PCB.
    • ​Soldering:​​ Leads are soldered to conductive pads on the opposite side (wave soldering or hand soldering).
    • ​Mechanical Strength:​​ Provides strong physical bonds, making it ideal for high-stress environments.
    • ​Reliability:​​ Better thermal and mechanical durability than SMT in some applications.
    • ​Larger Components:​​ Often used for bulky parts like connectors, transformers, and electrolytic capacitors.

Technical Parameters


PCB Assembly Capability

Item

Normal

Special

SMT

Assembly

PCB(used for SMT)

specification

Length and Width( L* W)

Minimum

L≥3mm, W≥3mm

L<2mm

Maximum

L≤800mm, W≤460mm

L > 1200mm, W>500mm

Thickness( T)

Thinnest

0.2mm

T<0.1mm

Thickest

4 mm

T>4.5mm

SMT components specification

Outline Dimension

Min size

0201(0.6mm*0.3mm)

01005(0.3mm*0.2mm)

Max size

200 * 125

200 * 125

component thickness

T≤15mm

6.5mm<T≤15mm

QFP,SOP,SOJ

(multi pins)

Min pin space

0.4mm

0.3mm≤Pitch<0.4mm

CSP/ BGA

Min ball space

0.5mm

0.3mm≤Pitch<0.5mm

DIP

Assembly

PCB specification

Length and Width( L* W)

Minimum

L≥50mm, W≥30mm

L<50mm

Maximum

L≤1200mm, W≤450mm

L≥1200mm, W≥500mm

Thickness( T)

Thinnest

0.8mm

T<0.8mm

Thickest

3.5mm

T>2mm


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Advantages of DQS Team
  1. On-time Delivery:
    • Owned PCBA factories 15,000 ㎡
    • 13 fully automatic SMT lines
    • 4 DIP assembly lines

2. Quality Guaranteed:

    • IATF, ISO, IPC, UL standards
    • Online SPI, AOI, X-Ray Inspection
    • The qualified rate of products reach 99.9%

3. Premium Service:

    • 24H reply your inquiry
    • Perfect after-sales service system
    • From prototype to mass production


Buy 0.5oz-15oz OSP Wireless Charger PCBA Through Hole Soldering PCB Board Assembly at wholesale prices
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