FR4 Gold Finger PCB

2 Layer Rigid Printed Circuit Board , FR4 High TG Material , Gold Fingers

PCB Specifications:

Layer Count: 2 Layer Rigid PCB

Material: FR4 S1000-2

Copper Thickness: 1/1OZ

Min Hole: 0.7MM

Min Trace: 20/8.5Mil

Solder Mask: Green

Surface Treatment: ENIG+Gold Fingers

Our Products&Services:

FAQ:

Question: What is ENEPIG Plating?

Answer: ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) is a type of surface plating applied on a Printed Circuit Board to protect it from environmental factors during storage and operation. ENEPIG is prepared by depositing electroless Nickel (Ni 3-5 μm), followed by electroless Palladium (Pd 0.05-0.1μm), and an immersion Gold layer (Au 0.03-0.05 μm). It is good for solder joint strength, gold wire bonding, aluminum wire bonding, and provides low contact resistance. It can easily be deposited on almost any PCB which is why it is also called the ‘Universal Finish’.

What are the advantages of ENEPIG over ENIG?

ENEPIG plating has an additional layer of Palladium when compared to the ENIG plating which consist of just Nickel and Gold. This additional layer helps avoid what is know as the ‘Black Pad’ syndrome i.e. the result of corrosion caused by the Gold to the Nickel layer.

Advantages of ENEPIG Finishes:

• Palladium layer totally covers the Nickel layer, and the amount of phosphorus in the palladium layer is less than in the Nickel layer, which inhibits the generation of black nickel (also called Black Pad syndrome).
• The Palladium fusion point (1,554°C) is higher than Gold (1,063°C). As a result of this, Palladium’s fusion speed at high temperatures is comparatively low, which allows more time for Nickel layer protection before going to the final assembly.
• Palladium is harder than Gold, which offers improved solder joint quality, wire bonding capacity, and antifriction.
• Using Palladium allows for the reduction in the thickness of the Gold layer, which eventually reduces the cost.
• It can withstand multiple reflow cycles
• Processing cost is comparatively lower than ENIG and ENEG surface finishes.
• Very-well adjustable for Lead-free solder tendency

Limitation of ENEPIG Surface Finish: It is more prone to fractures due to the brittleness of the tin-palladium layers formed on top of the nickel plating.

Uses of ENEPIG Surface Finishes

ENEPIG Surface Finishies are ideal for Printed Circuits Boards that support various package types including THT (through-hole technology), SMT, BGA, wire bonding, etc. They are often used in the aerospace & defense industry as well as the medical industry. ENEPIG finishes are used in high density, high performance devices.

Witgain Technology Ltd was established in 2007 in ShenZhen City. After over 10 years development, the company now posses two factories. One factory located in HuiZhou City which is near to ShenZhen. The other one locates in JiangXi Province. Marketing dept still locates in ShenZhen City.

We have about 300 employees in two factories and the monthly output is around 30000m2. Our marketing orientation is to make high difficult and special treatment pcb. Even though, we still accept normal 2-layer and multi-layer pcb orders. Our products cover simple double layer pcb, multi-layer pcb, HDI pcb, rigid-flex pcb, fpc, ceramic pcb, heavy gold/copper pcb etc. Wide product ranges and flexible order quantities allow us to satisfy most customer's demands. 

Quality and technology is what we value most and we will never stop improving our capabilities. Our customer's satisfication is always what we are seeking for.