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60mil Hybrid Multilayer RF PCB Board With Immersion Gold

Categories RF PCB Board
Brand Name: Bicheng
Model Number: BIC-193.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Base material: Composites of Ceramic, PTFE and Woven Fiberglass
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
PCB thickness: 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm )
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Copper weight: 0.5oz (17 µm), 1oz (35µm)
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..
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60mil Hybrid Multilayer RF PCB Board With Immersion Gold


TLY-5Z High Frequency PCB 60mil 30mil 20mil and 10mil Taconic RF PCB with Immersion Gold

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


Taconic's TLY-5Z high frequency laminates are advanced composites of ceramic, PTFE and woven fiberglass reinforcement. It is designed for low density applications such as aerospace having optimally low weight requirements. Since using ceramic and woven fiberglass, TLY-5Z has high stable property on dimension. The low density approach also makes it with a low Z axis expansion which is not possible with PTFE-rich composites. TLY-5Z has high thermally stability and it has just half the thermal expansion of PTFE-rich laminates, offers improved drilling and can be thermally cycled.


Benefits:

Low Z Axis CTE

Plated through hole stability

Low density (1.92 g/cm3)

Attractive price/performance ratio

Excellent peel strength

Compatible with flat copper


Typical applications of TLY-5Z PCB include:

1. Aerospace components: The PCB can be used in various aerospace components, taking advantage of its low weight and stability.


2. Low weight antennas for aircraft: The lightweight nature of the TLY-5Z PCB makes it suitable for manufacturing low-weight antennas used in aircraft.


3. RF passive components: The PCB can be utilized in RF passive components, benefiting from its excellent performance characteristics.



Our PCB Capability (TLY-5Z)

PCB Material:Composites of Ceramic, PTFE and Woven Fiberglass
Designation:TLY-5Z
Dielectric constant:2.20 +/- 0.04 (1.9GHz)
Dissipation Factor0.0015 (10GHz)
Layer count:Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm)
Laminate thickness:10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm )
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..

About Us

Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipment, radar systems, digital radio frequency antenna and other fields worldwide for 18 years. Our high frequency PCBs are mainly built on 3 high frequency material brands: Rogers Corporation, Taconic and Wangling. Dielectric constant ranges from 2.2 to 10.2 etc.


We also have divisions of FR-4 circuit board, flexible circuits and metal core PCBs featured as prototypes, small runs to mass production. We also actively research and build such high value added PCB projects as HDI, quick turn, impedance control, heavy copper and backplane board etc. This has made our PCB products generate an effective prolongation and complementation, as well as formation of integrated products line ranging from low-end to high-end.


Our PCBs are used for a variety of purposes, including, but not limited to, computer networking, safety and surveillance, power supply, telecommunication, automotive electronics, medical apparatus and instruments, national defense and industrial equipment etc.


Appendix: Typical Values of TLY-5Z

PropertyTest MethodUnitValueUnitValue
Dk @ 1.9 GHzIPC-650 2.5.5.5.1 Mod.2.20+/- 0.042.20+/- 0.04
Df @ 1.9 GHzIPC-650 2.5.5.5.1 Mod.0.0010.001
Df @ 10 GHzIPC-650 2.5.5.5.1 Mod.0.00150.0015
Tc(D)K (-55 ~150°C)IPC-650 2.5.5.6 Mod.ppm/°C-72ppm/°C-72
Dielectric Breakdown VoltageIPC-650 2.5.6kV45kV45
Dielectric StrengthIPC-650 2.5.6.2V/mil770V/mm30,315
Moisture AbsorptionIPC-650 2.6.2.1%0.03%0.03
Peel Strength (1 oz. copper)IPC-650 2.4.8lbs./inch7N/mm1.3
Volume ResistivityIPC-650 2.5.17.1Mohms/cm10^9Mohms/cm10^9
Surface ResistivityIPC-650 2.5.17.1Mohms10^8Mohms10^8
Tensile Strength (MD)IPC-650 2.4.18.3psi9137N/mm263
Tensile Strength (CD)IPC-650 2.4.18.3psi9572N/mm266
Tensile Modulus (MD)IPC-650 2.4.18.3psi182,748N/mm21260
Tensile Modulus (CD)IPC-650 2.4.18.3psi165,344N/mm21140
Elongation (MD)IPC-650 2.4.18.3%6%6
Elongation (CD)IPC-650 2.4.18.3%6.9%6.9
Flex Strength (MD)ASTM D790psi10,300N/mm271
Flex Strength (CD)ASTM D790psi11,600N/mm280
Flex Modulus (MD)ASTM D790psi377,100N/mm22600
Flex Modulus (CD)ASTM D790psi432,213N/mm22980
Dimensional Stability (MD)IPC-650 2.4.39 (Bake)% (10 mil)-0.05% (30 mil)-0.05
Dimensional Stability (CD)IPC-650 2.4.39 (Bake)% (10 mil)-0.17% (30 mil)-0.11
Dimensional Stability (MD)IPC-650 2.4.39 (Stress)% (10 mil)-0.07% (30 mil)-0.07
Dimensional Stability (CD)IPC-650 2.4.39 (Stress)% (10 mil)-0.22% (30 mil)-0.14
Density (Specific Gravity)IPC-650 2.3.5g/cm31.92g/cm31.92
Specific HeatIPC-650 2.4.50J/g°C0.95J/g°C0.95
Thermal ConductivityIPC-650 2.4.50W/M*K0.2W/M*K0.2
CTE (x-y) (50 - 150°C)IPC-650 2.4.41ppm/ºC30-40ppm/ºC30-40
CTE (z) (50 - 150°C)IPC-650 2.4.41ppm/ºC130ppm/ºC130
HardnessASTM D2240 (Durometer)-68-68
UL-94 Flammability RatingUL-94V-0V-0


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