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Quick turn 4 layer rigid flex pcb design ISO9001 / TS16949 approved

Categories Rigid Flexible PCB
Brand Name: No
Model Number: SL71210L037
Certification: UL,ROhs
Place of Origin: China
MOQ: 1pc
Price: Negotiation
Payment Terms: T/T, Western Union, MoneyGram, Paypal
Supply Ability: 10000pcs/ day
Delivery Time: 5-7 days
Packaging Details: ESD bag
Material: TG180 FR4
PCB Type: Rigid-flex
Layer: 4 layers
Feature 1: Gerber file needed
Feature 2: 100% E-test
Feature 3: Quality 2 years guarantee
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    Quick turn 4 layer rigid flex pcb design ISO9001 / TS16949 approved

    Quick turn 4 layer rigid flexible pcb ISO9001/ TS16949 approved

    FPC Process Capability

    ItemsFPC Process Capability
    Number of LayersSingle Sided, Double Sided, Multilayer, Rigid-flex PCB
    Based MaterialPI, PET
    Copper Thickness9um,12um,18um,35um,70um,105um
    Largest Board Area406mm X 610mm/16"X 24",The largest could be 7 meters length in Single sided Flexible Printed Circuit Board
    Minimum Hole Diameter of Mechanical Drilling0.2mm/0.008"
    Minimum Hole Diameter of Laser Drilling0.075mm/0.03"
    Minimum Hole Diameter of Hole-punching0.50mm/0.02"
    Tolerance of Plated Through Hole+/-0.05mm/±0.02"
    Minimum Line Width0.075mm/0.003"
    Minimum Line Spacing0.075mm/0.003"
    Peel Strength1.2kg f/cm
    Shape ProcessingDie Stamping, Cutting, Laser Prototyping
    Appearance of Tolerance+/-0.05mm/ +/-0.02"
    Solder Mask TypePI Solder Mask Coverlay Film or PET Solder Mask Covelay Film Lamination
    Multi-colored Liquid Photo-Imageable solder Mask Ink, Thermosetting Solder Mask Ink
    Surface TreatmentPlating Tin, Immersion Tin, Plating Nickel Gold, ENIG (Electroless Nickel Immersion Gold),Immersion Nickel Gold, Chemical Nickel Gold,OSP( Organic Solderability Preservatives), Immersion Silver

    Our Service

    Only focus on FPC manufacturing, Professional FPC technology.

    1. OEM services provided, Product and Package
    2. Sample order is acceptable ,the order quantity is unrestricted.
    3. Response to your inquiry within 24 hours.
    4. After sending, we will track the products for you once every two days, until you get the products.
    5. Professional sales team could answer any technical question at fastest speed and help you to solve any problem on design.
    6. Supply the professional suggestion on design and usage.

    Quick Detail

    1. Higher circuit density
    2. Decreased Assembly Time and Costs.
    3. Increased Heat Dissipation
    4. A multi-layer flex circuit combines several single-sided or double-sided circuits with complex interconnections, shielding and/or surface mounted technologies in a multi-layer design.
    5. Several copper layers separated encapsulated by dielectric layers. Metal layers are often connected by metalized thru-holes
    6. The surface treatment is mostly ENIG, but it is acceptable for Plating Nickel-Gold, Plating Tin, Immersion Tin and OSP.
    7. The multilayers may or may not be continuously laminated together throughout the production process. If your design needs require maximum flexibility, continuous lamination may not be appropriate.


    1. Soldermask ink as soldermask layer, including Black, Red, Yellow and Green. Among then, Black one could be also used Black PI coverlay film.
    2. FCCL material. Rolled Anneal Copper. But you could change it into Elctro-deposited copper.
    3. Strong singal quality.
    4. Excellence elctronic property and reliable dielectric performance.
    5. Increased the reliablity in circuitry system.
    6. Lighter weight than PCB, reduce the weight of final products.
    7. High heat resisting property, in favor of increasing heart dissipation
    8. Immersion Nickel Gold. Please note that it is not pure gold. Nickel could assist the gold to hard without adding more gold
    9. Strong signal quality.
    10.Widely used as chip of SIM cards and Smart IC card.
    11. Materials thinkness. 18um copper, 25um PI, and 20um adhesive on FCCL, 12.5um PI and 15um adhesive on PI coverlay film. More options please view the below parameter lists.

    Specification of standard Polyimide film based coverlay
    SpecificationPI Flim Thickness (um)Adhesive Thickness (um)

    Specification of standard Haloger-free PI film based flexible copper clad laminate (3- layer FCCL)
    SpecificationMaterials Thickness (um)
    PI:CopperPI FilmCopper FoilAdhesive
    0.5 mil:0.5 OZ12.51813
    1 mil:0.5 OZ251820
    1 mil:1 OZ253520
    2 mil:1 OZ503520

    About us
    Shinelink Company has been an industry leading FPC manufacturer since 2004.
    Main Products, Flex PCB (Flexible printed circuit), Rigid-Flex PCB and MCPCB.

    1. More than 12 years manufacturing experience in FPC field.
    2. Focus on FPC this only product.No PCB production line.
    3. Near 12000 square meters production base.
    4. Caple technical personelconsist of some industry experts and elites who are working for more than 10 years in FPC field.
    5. Many advanced and complete production equipments for FPC Manufacturing.
    6. All manufacturing process is only made in our plant.
    7. Through the professional training, our sales team could offer the clients with the quick answer to the technology question, and the most professional suggestion on the optimization of artwork design. It would help to better improve the project rationality and decrease the production cost, thereby providing with the best cost-effective process plan.
    8. All the raw materials passed ROHS certification through SGS and flammability UL94 V-0,inculding FCCL and Polyimide Coverlay Film.

    Packing and Delivery


    1. Firstly hermetic plastic bag fill with products,
    2. Then bubble sheet separates them,
    3. Finally paper carton packing.


    1. It would take 7-9 days to mufacture it after deposit received.Production time would depend on your drawing and process plan.
    2. DHL,FedEx, UPS delivery. It is faster than vessel.Barely deliever it by vessel.

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