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Green Multilayer Printed Circuit Board Assembly , Surface Mount PCB Assembly

Categories SMT PCB Service
Brand Name: China chao sheng
Model Number: 6-layer FPC production + SMT+TEST+DIP
Place of Origin: Shenzhen, Guangdong, China
MOQ: 1PCS
Price: Negotiation
Payment Terms: T/T, Western Union
Supply Ability: 5-200K/pcs per month
Delivery Time: 25day
Packaging Details: Anti-static bag + Anti-static bubble wrap + Good quality carton box
Certification: ISO/UL/RoHS/TS
Surface finishing: ENIG
Base material: TACONIC
Min. line spacing: 0.075mm
Board thickness: 1.6mm-3.2mm
Min. line width: 0.075mm/0.1mm(3mil/4mil)
Copper thickness: Up to 6 oz Cu
Product name: China oem factory smt printed circuit boards pcb assembly service
Material: FR4/94v0/Aluminum/cem-1 cem-3/
Solder mask: Green
Service: Component Source
Solder mask color: Green
Layer: 1-24layers
Usage: PCB assembly
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    • Product Details
    • Company Profile

    Green Multilayer Printed Circuit Board Assembly , Surface Mount PCB Assembly

    6-layer FPC production + SMT+TEST+DIP,SMT PCB Service,wooden box,rigid flex pcb manufacturers,high speed pcb layout

    Printed circuit board (pcb) and PCBA products
    Communication terminal, communication station, electronic communication, optical fiber, optical module, communication equipment, communication instrument, computer, household appliance, testing equipment, testing instrument, instrument, SD card, SG card, mobile phone, computer, various antennas, cars, music Equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products,computers,etc.Applications;
    Flexible circuit board (FPC) and FPCA product areas
    CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument, Medical equipment, banking equipment, industrial instruments, LED light bars, military, aviation, aerospace, defense and other high-tech products, of which more than 70% of the products are exported to Europe, America, Europe, Central Europe, Western Europe, Southeast Asia, Asia-Pacific and other countries and area.

    Product Description


    Specifications

    1. Our professional engineering team can put your project into production in a short time. Sample pictures and
    2. BOM are needed to make customized products.Also we can supply for the copy of the PCB and PCBA ,so you
    3. just sent me the enquiry is ok ,we can do what you need to do !
    4. We can supply CAD and Pro-E designed precision moulds. Moulds can be designed and manufactured
    5. according to customers' requests or samples. Plastic injection processing available.
    6. Purchasing the electronic components for you to the production of the PCBA
    7. We have advanced equipment for through-hole and SMT DIP COB cable Assembly
    8. ROHS compliant and lead-free process.
    9. In-circuit, functional tests& burn-in tests, full system test
    10. High output to guarantee prompt delivery.

    Product Details

    1. 6-layer FPC production + SMT+TEST+DIP,SMT PCB Service,wooden box,rigid flex pcb manufacturers,high speed pcb layout
    2. FPCBA processing method,Six-layer FPCHDI, laser hole 0.10mm, mobile phone motherboard,
    3. FPC production + it contains SMT, DIP, TEST,

    PCB capability and services:

    1. Single-sided, double-sided & multi-layer PCB (up to 30 layers)
    2. Flexible PCB (up to 10 layers)
    3. Rigid-flex PCB (up to 8 layers)
    4. CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material.
    5. HAL, HAL lead free, Immersion Gold/ Silver/Tin, Hard Gold, OSP surface treatment.
    6. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard.
    7. Quantities range from prototype to volume production.
    8. 100% E-Test

    PCB, FPC process production capability

    Technical ltemMassProductAdvanced Technology
    201620172018
    Max.Layer Count26L36L80L
    Through-hole plate2~45L2~60L2~80L
    Max.PCBSize(in)24*52"25*62"25*78.75"
    The layer number of FPC1~36L1~50L1~60L
    Max.PCBSize(in)9.8"*196"9.8"*196"10"*196"Reel to reel
    Layeredplatelayer2~12L2~18L2~26L
    Max.PCBSize(in)9"*48"9"*52"9"*62"
    Combination of hard and soft layers3~26L3~30L3~50L
    Interconnect HDI5+X+5Interconnect HDI7+X+7Interconnect HDI8+X+8,Interconnect HDI
    HDI PCB4~45L4~60L4~80L
    Interconnect HDI3+20+34+X+4Interconnect HDI4+X+4,Interconnect HDI
    Max.PCBSize(in)24"*43"24"*49"25"*52"
    MaterialFR-4 RogersFR-4 RogersFR-4 Rogers
    Base materialHalogenfree,LowDKHalogenfree,LowDKHalogenfree,LowDK
    Build-up MaterialFR-4FR-4FR-4
    BOard,Thickness(mm)Min.12L(mm)0.430.42~8.0mm0.38~10.0mm
    Min.16L(mm)0.531.60~8.0mm0.45~10.0mm
    Min.18L(mm)0.632.0~8.00.51~10.0mm
    Min.52L(mm)0.82.50~8.0mm0.65~10.0mm
    MAX(mm)3.510.0mm10.0mm
    Min.CoreThickness um(mil)254"(10.0)254"(10.0)0.10~254(10.0mm)
    Min.Build up Dielectric38(1.5)32(1.3)25(1.0)
    BaseCopperWeightInner Layer4/1-8 OZ4/1-15 OZ4/1-0.30mm
    Out Layer4/1-10 OZ4/1-15 OZ4/1-30 OZ
    Gold thick1~40u"1~60u"1~120u"
    Nithick76~127u"76~200u"1~250u"
    Min.HOle/Land um(mil)150/300(6/12)100/200(4/8)100/200(4/8)
    Min.Laser via/landum(mil)60/170(2.4/6.8)50/150(2/6)50/150(2/6)
    Min. IVH,Hole size/landum(mil)150/300(6/12)100/200(4/8)100/200(4/8)
    DieletricThickness38(1.5)32(1.3)32(1.3)
    125(5)125(5)125(5)
    SKipviaYesYesYes
    viaoNhie(laserviaon BuriedPTH)YesYesYes
    Laser Hole FillingYesYesYes
    TechnicalltemMass ProductAdvanced Technolgy
    2017year2018year2019year
    Drill hole depth ratioThroughHole2017year.40:1.40:1
    Aspet RatioMicro Via.35:11.2:11.2:1
    Copper Filling Dimple Size um(Mil)10(0.4)10(0.4)10(0.4)
    Min.LineWidth&spacelnner Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
    Plated Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
    BGAPitch mm(Mil)0.30.30.3
    Min.PTH Hole ring um(mil)75(3mil)62.5(2.5mil)62.5(2.5mil)
    Line Width Control∠2.5MIL±0.50±0.50±0.50
    2.5Mil≤L/W∠4mil±0.50±0.50±0.50
    ≦3mil±0.60±0.60±0.60
    Laminated structureLayer by layer3+N+34+N+45+N+5
    Sequential Build-up20L Any Layer36L Any Layer52L Any Layer
    Multi-layer overlayN+NN+NN+N
    N+X+NN+X+NN+X+N
    sequential Lamination2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
    Soft and hard bonding2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
    PTH filling processPTH resin plug hole + plating fill
    Electroplated hole/copper plug hole
    PTH resin plug hole + plating fill
    Electroplated hole/copper plug hole
    PTH resin plug hole + plating fill
    Electroplated hole/copper plug hole

    Detailed Specification of PCB Manufacturing

    1layer1-30 layer
    2Material

    CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide,

    Aluminum-based material.

    3Board thickness0.2mm-6mm
    4Max.finished board size800*508mm
    5Min.drilled hole size0.25mm
    6min.line width0.075mm(3mil)
    7min.line spacing0.075mm(3mil)
    8Surface finish

    HAL, HAL Lead free,Immersion Gold/ Silver/Tin,

    Hard Gold, OSP

    9Copper thickness0.5-4.0oz
    10Solder mask colorgreen/black/white/red/blue/yellow
    11Inner packingVacuum packing,Plastic bag
    12Outer packingstandard carton packing
    13Hole tolerancePTH:±0.076,NTPH:±0.05
    14CertificateUL,ISO9001,ISO14001,ROHS,TS16949
    15Profiling punchingRouting,V-CUT,Beveling

    PCB Assembly services:


    Automatic Pick & Place
    Component Placement as Small as 0201
    Fine Pitch QEP - BGA
    Automatic Optical Inspection
    Through-hole Assembly
    Wave Soldering
    Hand Assembly and Soldering

    Material Sourcing
    IC pre-programming / Burning on-line

    Function testing as requested

    Aging test for LED and Power boards

    Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc)
    Packing design

    Conformal coating
    Both dip-coating and vertical spray coating is available. Protecting non-conductive dielectric layer that is

    applied onto the printed circuit board assembly to protect the electronic assembly from damage due to

    contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments.

    When coated, it is clearly visible as a clear and shiny material.
    Complete box build
    Complete 'Box Build' solutions including materials management of all components, electromechanical parts,

    plastics, casings and print & packaging material


    Testing Methods


    AOI Testing
    · Checks for solder paste
    · Checks for components down to 0201"
    · Checks for missing components, offset, incorrect parts, polarity
    X-Ray Inspection
    X-Ray provides high-resolution inspection of:
    · BGAs
    · Bare boards


    In-Circuit Testing
    In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by

    component problems.
    · Power-up Test
    · Advanced Function Test
    · Flash Device Programming
    · Functional testing


    Detailed Specification of Pcb Assembly

    1Type of AssemblySMT and Thru-hole
    2Solder TypeWater Soluble Solder Paste,Leaded and Lead-Free
    3ComponentsPassives Down to 0201 Size
    BGA and VFBGA
    Leadless Chip Carries/CSP
    Double-Sided SMT Assembly
    Fine Pitch to 08 Mils
    BGA Repair and Reball
    Part Removal and Replacement-Same Day Service
    3Bare Board SizeSmallest:0.25x0.25 Inches
    Largest:20x20 Inches
    4File FormatsBill of Materials
    Gerber Files
    Pick-N-Place File(XYRS)
    5Type of ServiceTurn-Key,Partial Turn-Key or Consignment
    6Component PackagingCut Tape
    Tube
    Reels
    Loose Parts
    7Turn Time15 to 20 days
    8TestingAOI inspection
    X-Ray inspection
    In-Circuit testing
    Functional test

    FAQ:

    Q: What files do you use in PCB fabrication?

    A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position

    Q: Is it possible you could offer sample?

    A: Yes, we can custom you sample to test before mass production

    Q: When will I get the quotation after sent Gerber, BOM and test procedure?

    A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.

    Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?

    A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing

    Q: How can I make sure the quality of my PCB?

    A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.

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