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SMT FR408 Multilayer Printed Circuit Board

Categories PCB Assembly Service
Brand Name: CESGATE
Model Number: NA
Certification: UL, IATF16949, ISO9001
Place of Origin: China
MOQ: 1PCS( NO MOQ)
Price: Negotiable (Depends on your GERBER and BOM)
Payment Terms: T/T, L/C
Supply Ability: 13kk soldering spot/day
Delivery Time: 3-7 working days
Packaging Details: PCB: Vacuum Packing / PCBA: ESD Packing
Product name: SMT Electronics Multilayer Printed Circuit Board PCB Assembly Service One-Stop Oem
Feature: One-Stop Oem
Min package: 03015
Profiling Punching: Routing/V-CUT/Beveling
High-end equipment: FUJI NXT3/XPF laminator
Bow&Twist: ≤0.5%
Test: AOI/ X-Ray/Flying-Probe/Function Test
Other Service: Components purchase /Assembly/Custom packaging
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    • Product Details
    • Company Profile

    SMT FR408 Multilayer Printed Circuit Board

    Electronics Multilayer Printed Circuit Board PCB Assembly Service One-Stop Oem


    Advantages:

    • Professional Surface-mounting and Through-hole soldering Technology
    • Various sizes like 1206, 0805, 0603 components SMT technology
    • ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
    • PCB Assembly service With CE, FCC, Rohs Approval
    • Nitrogen gas reflow soldering technology for SMT.
    • High Standard SMT&Solder PCB Assembly service Line
    • High density interconnected board placement technology capacity.

    Services CESGATE Provided:


    • The whole process is equipped with a professional team to serve you.
    • Free stack-up design service, according to your gerber and impedance until you are satisfied.
    • Felxible payment methods and negotiable payment terms
    • Turnkey service from PCB fabrication, PCB assembly service, BOM procurement to delivery.



    Specification


    NO.ItemsCapabilities
    1Layers2-68L
    2Maximum machining size600mm*1200mm
    3Board thickness0.2mm-6.5mm
    4Copper thickness0.5oz-28oz
    5Min trace/space2.0mil/2.0mil
    6Minimum finished aperture0. 10mm
    7Maximum thickness to diameter ratio15:1
    8Via treatmentVia, blind&buried via, via in pad, Copper in via …
    9Surface finish/treatmentHASL/HASL lead free, Chemical tin, Chemical Gold, Immersion gold Inmersion Silver/Gold, Osp, Gold Plating
    10Base MaterialFR408 FR408HR, PCL-370HR;IT180A, Megtron 6(Panasonic);Rogers4350,
    Rogers4003, RO3003, Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)
    11Solder mask colorGreen.Black.Red.Yellow.White.Blue.Purple.Matte Green. Matte Black
    12Testing ServiceAOI, X-Ray, Flying-Probe, Function Test, First Article Tester
    13Profiling PunchingRouting,V-CUT,Beveling
    14Bow&twist≤0.5%
    15HDI type1+n+1,2+n+2,3+n+3
    16Min mechanical aperture0.1mm
    17Min laser aperture0.075mm

    Company Descripiton


    We CESGATE always take it as our mission by "Priority Customer,Effective Service", we insist in this management principle of "Development promote Management, Management benefit Efficiency". All of our employee keep firmly in mind with "High Quality ask for survival,High echnology ask for development ". We will strive to achieve our strategic objective: Professional Management, Large-scale Industry, International Market.





    FAQ


    Q: Why choose us?
    CESGATE: Professional and experienced R&D team. Advanced production equipment, scientific and reasonable process flow.
    Reliable and strict quality control system. We test all our products before shipment to make sure everything is in perfect condition.
    Q: How long does it take for PCB quote?
    CESGATE: Normally 12 hours to 48 hours as soon as receive internal engineer evaluate confirmation.
    Q: The Wire Bonding process is required when the circuit board is printed. What should I pay attention to when making the circuit board?
    CESGATE: When making circuit boards, the surface treatment options are mostly "nickel palladium gold ENEPIG" or "chemical gold ENIG". If the Al aluminum wire is used, the gold thickness is recommended to be 3μ”~5μ”, but if the Au gold wire is used, the gold thickness should preferably be more than 5μ”.
    Q: The lead-free process is required when the circuit board is printed. What should I pay attention to when making the circuit board?
    CESGATE: The lead-free process during printing is higher than the temperature resistance requirements of the general process, and the temperature resistance requirements must be above 260 °C. Therefore, it is recommended to use a substrate above TG150 when selecting the substrate material.
    Q: Can your company provide the serial number when making circuit board text?
    CESGATE: Serial numbers can be provided, and in addition to text serial numbers, QR-CODE can also be provided for customers to query.
    Q: How long is the shelf life of the PCB board and how should it be stored?
    CESGATE: 25℃ / 60%RH is recommended when the PCB is stored. The plate itself has no shelf life, but if it exceeds three months, it needs to be baked to remove moisture and stress, and it should be used immediately after baking. It is recommended that the pieces should be loaded within 6 months of storage to reduce the phenomenon of rejection and explosion.
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